Pack Expo International

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Pack Expo Heat and Control

Heat and Control at Pack Expo

Heat and Control will showcase a broad portfolio of snack processing, seasoning, weighing, packaging and inspection technologies at Pack Expo International 2026 in Chicago.
LOMA Pack Expo

Loma Systems Prepares for Pack Expo

Loma Systems will showcase its latest developments in metal detection, X-ray inspection and checkweighing at PACK EXPO International 2026, taking place from 18–21 October at McCormick Place in Chicago.
HMC Products

HMC Targets High-Speed Snack Packaging

HMC Products is set to showcase its latest high-speed horizontal form-fill-seal pouching technology at PACK EXPO International 2026, highlighting a system designed to help snack manufacturers increase throughput while maintaining pack quality and reducing waste.
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