Pack Expo

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EPS Printing

EPS to Highlight Packaging Printing

Engineered Printing Solutions (EPS) will stage the world-first live demonstration of its new XD-AQ high-viscosity water-based inkjet system at PACK EXPO, giving packaging manufacturers, converters and distributors their first opportunity to see the quality and vibrant colour impact of the technology.
SOMIC press release

SOMIC Focuses on Digital Service

SOMIC Packaging will showcase new secondary packaging and digital service technology at PACK EXPO International, including its Eagle and Connect diagnostic systems and the North American debut of its SOMIC 202 platform.
Mettler Toledo X56

METTLER TOLEDO expands inspection portfolio

METTLER TOLEDO Product Inspection will showcase a range of new inspection technologies at Pack Expo 2026 in Chicago, including an X-ray system designed to improve the detection of difficult low-density contaminants in food products.
MoistTech

MoistTech Targets Real-Time Snack Quality

MoistTech will showcase its IR-3000 near-infrared moisture sensor at PACK EXPO International 2026, demonstrating how continuous moisture measurement can help snack manufacturers improve product consistency, reduce waste and optimise energy use.
vdl

VDL Showcases High-Speed Packaging

VDL Packaging will demonstrate its UVA Dynamic Twin Tube vertical form fill seal machine at PACK EXPO International 2026, highlighting a high-speed packaging solution designed to increase output while making efficient use of production floor space.
TNA Quantum

TNA Previews New Packaging Platform

TNA Solutions will give the tna robag® Quantum its exclusive North American preview at PACK EXPO International 2026, showcasing the next generation of its vertical form, fill and seal packaging platform ahead of its official release in 2027.
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